Copy of Vacuum equipment

Vacuum furnaces

Vacuum furnaces are designed for heating in vacuum and in a protective gas environment, quenching in gas and oil media of titanium nickel and other heat-resistant alloys.
They comply with all NADCAP requirements and AMS 2750D and RPS 953 standards.

Specifications:
• Operating temperature 500 - 2200°C.
• Uniformity of temperature in the working area of the furnace is not more than ± 5 ° C.
• The maximum discharge in the working area is up to 10-6mbar.
• The maximum working pressure of the gas at a temperature of 20 bar.
• Molybdenum, tungsten or graphite ring heating elements.
• Water cooling of the furnace body and door, current leads and cooling gas circulation pipes. External gas quenching system with a powerful fan and a water heat exchanger.
• Autoclave type furnace door with pneumatic locking.
• Sealed connector for connecting up to 12 thermocouples in the furnace.
• A large set of additional components at the discretion of the customer.
• Light and sound alarm of violations in the operation of furnace systems with output to the display.
• Long-term operation with minimal maintenance. Free access to all furnace systems.
• Computer control and automatic operation.

Emulation of outer space

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Resistive Thermal Evaporation

Resistive evaporation is a vacuum deposition process that uses electrical energy to heat the cathode, which in turn heats the deposited material to such an extent that it vaporizes it. The process can be carried out in a very high vacuum, which makes it possible to increase the free path of the atom and thereby reduce the possibility of contamination of the film. A high deposition rate can be achieved. Lower particle energy can reduce the effect of substrate damage. Angstrom Engineering has developed thin film deposition systems based on this technology, which allow applying a wide range of materials including: metals, organic polymers and inorganic polymers. The process can be controlled using QCM (quality control manual), a temperature and optical control system providing results with high quality and repeatability.

Equipment for optimizing spraying processes

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Substrate temperature control
Improving grain boundary migration, post–process annealing, and surface reaction control are a set of applications for the substrate temperature control function. For various heating or cooling applications, the company has several standard options. Solutions are also possible according to the individual request of the customer for your substrates and temperature range.
Offset voltage
If you are following the control of the film density or the improvement of adhesion, bias voltage may be the solution in this case. Angstrom Engineering can configure your platform by enabling DC or RF offset.
Planetary mechanism
Our platform with a planetary mechanism allows us to improve the uniformity of films on a large number of substrates. Usually the planetary mechanisms pre-installed on our machines of the Åmod and EvoVac line can significantly increase the system performance.
Cleaning of substrates
In-situ cleaning with an ion beam or glow discharge guarantees the preparation of substrates for deposition of high-quality layers. To remove its own oxides, Angstrom Engineering suggests installing a pre-cleaning option on your system.

Ion sputtering

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In IAD (ion sputtering), a source of a wide ion beam directs a scattered ion beam of ions with different energies directly to the substrate, usually together with a magnetron sputtering source or an electron beam sputtering source. An inert gas such as Ar or reactive gases such as O2 and N2 can be used to provide additional chemical reactions during film growth. IAD processes make it possible to improve the processes of film growth through reactions on the surface, control the film density and improve the adhesion of the film. Angstrom Engineering can improve the capabilities of your system by adding an ion source to your processes. Angstrom Engineering's software solutions allow for precise and thorough control of processes in systems.

Electron beam evaporation

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In electron beam evaporation, the cathode emits a high-energy beam of electrons focused by a magnetic field, which, falling on the material in the crucible, carries away the sprayed material deposited on the substrate from the crucible. Powerful evaporators and sets of evaporators with an ordered design allow for high film growth rates and high film thicknesses. Also, this design allows you to increase the number of processes and the spraying time before the chamber is evacuated to replenish the evaporated material in the source.
The application of refractory materials can reach high speeds, which can be effectively used to increase the heat resistance of metal and ceramic films. The evaporated precipitated material can support a surface layer of non-molten material that protects the crucible from corrosion or contamination.
Angstrom Engineering installs electron beam evaporators into systems and provides advanced spray control and management for the most demanding applications. Systems can be configured using both standard platforms (systems) and on an individual order for full compliance with the requirements of the customer.

Magnetron sputtering

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The collision of high-energy particles contained in the plasma emits atoms from the surface of the target material, which condense on the surface of the substrate creating a film on the substrate. Magnetron sputtering processes occur at a higher pressure than in evaporation. Processes can also occur at a shorter free path of the atom. Films obtained by magnetron sputtering have stoichiometry better representing the composition of the target material than the composition obtained by evaporation. Definitely, the process has advantages in terms of the adhesion level of the resulting films due to the higher particle impact energy.
Sprayed targets and sources can be of different sizes to optimize the speed, performance and uniformity of the resulting films.
Angstrom Engineering's magnetron sputtering technology combines the highest quality sputtering sources with a gas pressure monitoring and control system.
Systems with magnetron sputtering sources from Angstrom Engineering can be equipped with RF, DC, pulsed DC or MF electrical sources
Specially configured sources make it much easier to apply magnetic materials such as Fe, Ni and Co and support the use of thicker targets.

Resistive thermal evaporation

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Resistive evaporation is a vacuum deposition process that uses electrical energy to heat the cathode, which in turn heats the deposited material to such an extent that it vaporizes it. The process can be carried out in a very high vacuum, which makes it possible to increase the free path of the atom and thereby reduce the possibility of contamination of the film. A high deposition rate can be achieved. Lower particle energy can reduce the effect of substrate damage. Angstrom Engineering has developed thin film deposition systems based on this technology, which allow applying a wide range of materials including: metals, organic polymers and inorganic polymers. The process can be controlled using QCM (quality control manual), a temperature and optical control system providing results with high quality and repeatability.

Integration of systems with glove boxes

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Angstrom Engineering is a leader in PVD solutions using controlled atmosphere glove boxes. This integration of systems makes it possible to carry out processes related to environmental control requirements. Systems with integrated glove boxes allow you to process and store sensitive materials and substrates when moving products from one process to another. Angstrom Engineering is ready to configure the system according to your size and placement requirements and process requirements