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Vacuum equipment
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Microelectronics equipment
Optical and electron microscopy
Heat treatment equipment
Installation of micro welding 53XX BDA
The ideal solution for research institutes and laboratories, universities and experimental productions
Installation of micro welding 5350
The ideal solution for research institutes and laboratories, universities and experimental productions
Electron beam installation for micro-welding
It is used for electron beam processing of objects
Installation of micro welding 53XX BDA
The F&S BONDTEC Series 53 semi—automatic installation has absorbed many advantages of the automatic installation of micro-welding with thick and thin wires of the 56XX series - the same reliable design of the head and drives, a stable base, a high-quality generator, variability of welding parameters and profiling of the loop-forming movement.
All this makes it possible to use the F&S BONDTEC 53XX ultrasonic micro-welding unit even in the production of experimental batches of complex and critical products in a continuous mode.
The universal welding head B-DA (Ball-Deep Access) allows you to make connections using ball-wedge methods (gold wire with a diameter of 17.5–75 microns), wedge-wedge in a deep well (gold and aluminum wire with a diameter of 17.5–75 microns) and thin tape up to 250 microns wide. Additional equipment is a kit for mounting crystals on an adhesive, which makes this model a unique solution for the laboratory.
The micro-welding unit has a smooth automatic movement along the Z axis for a length of up to 60 mm with a resolution of 1 microns, which ensures accurate determination of the moment of contact with the surface of the contact pad, as well as the removal of the head to a safe height when changing products.
- Welding method - Ball welding, wedge-wedge, ball-wedge
- Wire type - 17.5...75 microns, gold, aluminum, tape 30×12.5...250×25 microns, coil 2" or 1/2"
- Z-axis drive - 60 mm, 1 micron pitch
- Y-axis drive - 4 mm, step 2 microns
- Desktop and manipulator - "frame" size 18×18 mm, mechanical drive with X/Y displacement factor 1:7
- Programmable clamping force - 5...150 sN
Installation of micro welding 5350
- Welding method - Wedge-wedge, ultrasonic
- Wire type - 100...600 microns, aluminum,
- coil 4" 250×25 microns, coil 2" or 1/2"
- Z-axis drive - 60 mm, 1 micron pitch
- Y-axis drive - 4 mm, step 2 microns
- The size of the "frame" is 18×18 mm, mechanical drive with an X/Y displacement factor of 1:7
- Programmable clamping force - 100...1000 sN
X-ray diffractometers
DDCOM X-ray diffractometer for determining orientation in single crystals with an Omega-scanning meter allows for one revolution in a short time
Combined X-ray diffractometer
Fully automated vertical three-axis diffractometer for determining orientation in various crystals
Rohde&Schwarz ZA24 2 ports
Electron beam installation for micro-welding
Rohde&Schwarz ZA24 4 ports
The ZA24 vector analyzer, developed by Rohde & Schwarz, is one of the representatives of the precision analyzers of the ZVA series
Ultra violet spectrophotometer UV-2100
Designed for chemical analysis in various fields of industry, education and science
IR-Fourier spectrometer WQF-510/520
Fields of application of spectrometers: petrochemistry, biology, medicine, environmental protection, materials science, trade, national security, etc.
Microwave sample preparation systems for AAS and ICP spectrometry MICHEM
Allows the splitting of organic and inorganic samples by liquid reagents under controlled high pressure and high temperature
Installation of electrothermal atomization WF-1C
installation of electrothermal atomization
WFX-110
Method of atomic absorption spectrometry using flame oxygen-saturated air - acetylene
WFX-210
Automatic Atomic absorption spectrometer
X-ray diffractometers
DDCOM X-ray diffractometer for determining the orientation in single crystals with an Omega-scan meter allows for one revolution in a short time, up to 5 seconds and with high accuracy up to 1/100 ° to determine the orientation of the crystal lattice in 3D, which is 200 times faster than the common Tehta-scan (Theta scan) method
Technical specifications
Technical specifications
- X-ray source - 30 W air-cooled X-ray tube, Cu anode
- Detectors - two scintillation detectors
- The sample holder is a rotary table with an accuracy of 0.01°, a tool for determining the position and marking of the sample
- Overall dimensions - 600 mm × 600 mm × 850 mm
- Weight - 80 kg
- Power supply - 100-230 V, 100 W, single-phase
- Room temperature - ≤ 30 ° C
- The required space is about 1.5 m x 1.5 m, space is required for computer placement
Combined X-ray diffractometer
On this diffractometer, it is possible to carry out a complete and accurate determination of the orientation of the crystal lattice in single crystals of complex shape, i.e. having a curved or curved surface (turbine blades, rods, etc.), the ability to determine the orientation by both Omega scanning and Theta scanning by S (lateral reflex) and C (centric) method.
However, the diffractometer is not limited only to orientation measurements, it can also be used for standard diffractometric studies of any single crystals.
The software allows for automatic, semi-automatic and manual Theta scanning, makes it possible to obtain information both on single layers and a complete picture of the crystal lattice.
Technical specifications
However, the diffractometer is not limited only to orientation measurements, it can also be used for standard diffractometric studies of any single crystals.
The software allows for automatic, semi-automatic and manual Theta scanning, makes it possible to obtain information both on single layers and a complete picture of the crystal lattice.
Technical specifications
- X-ray source - Standard X-ray tube, Cu anode
- Detectors - Scintillation detector (single or double)
- Maximum accuracy - up to 1/1000°
- The sample holder is a rotary table with an accuracy of 0.01°, a tool for determining the position and marking of the sample
- Crystal collimator - Primary channel Ge or Si collimator, min. measured expansion: < 10 arc sec.
- Projection construction - 1Stol X-Y, plane resolution 0.1 mm
- Software - XRDStudio
- Operating system - Windows 7 or higher, NET Framework
- Water cooling - consumption 4L/min, max.pressure 8 bar, temperature ≤ 30° C
- Overall dimensions - H1950 mm × D 820 mm × W 1200 mm
- Weight - ~650 kg
- Power supply - 208-230V, 16A, single-phase, 50-60 Hz
- Room temperature - ≤ 30°C
- The required space is about 1.5 m x 1.5 m, space is required for computer placement
- Certification compliance - ISO 9001, CE certificate of conformity
Rohde&Schwarz ZA24 4 ports
Technical specifications
- Frequency range - from 10 MHz to 24 GHz
- Measurement time - < 3.5 microseconds
- Dynamic range - type. >140 dB
- Output power - >13 dBmW, type. 15 dBmW
- IF band - from 1 Hz to 1 MHz
- Number and type of measuring ports - 4
Ultra violet spectrophotometer UV-2100
Technical characteristics of the UV-2100 spectrophotometer
- Spectral range, 190-910 nm
- Accuracy of wavelength setting in the entire range, ± 0.3 nm
- The width of the selected spectral interval, 0.1, 0.2, 0.5, 1.0, 2.0 nm
- The range of the measured transmittance, optical density, -0.300 - 4,000 A
- Photometric accuracy ±0.3%T (0-100%T), ±0.002A(0-0.5A), ±0.004A(0.5A-1A)
- Photometric reproducibility 0.001A(0-0.5A)
- Operating mode T, A (-0.3-4A), E
- Baseline linearity ±0.001A
- Scattering, at a wavelength of 340 nm, <=0.05 %
- External RS 232 output
- Light source: UV range - deuterium lamp, Visible range - tungsten halogen lamp
- Zero signal drift, 0.0004 A/h
- Photometric linearity at 1.0 A, ±0.001A
- FEU Detector
- Power supply, 220/50 Hz, 110/60 Hz
- Power consumption, no more than 400 W
- Weight, 45 kg
IR-Fourier spectrometer WQF-510/520
Technical characteristics of IR-Fourier spectrometers BRAIC
- Spectral range: 7000 - 400 cm-1
- Spectrometer resolution: 0.85 cm-1 (WQF-510); 0.5 cm-1 (WQF-520)
- Reproducibility: better ±0.01cm-1
- Scanning speed: 0.2~2.5cm-1, automatically selected for each type of detector
- Beam Separator: KBr
- IR source: external, air-cooled, high-efficiency spherical module
- Spectrometer detectors: DTGS, MCT (on request)
- Software Package
Microwave sample preparation systems for AAS and ICP spectrometry MICHEM
Characteristics:
- As for decomposition, the dissolution rate of the sample using microwave enhanced chemical technology is 10-100 times faster than using electric heating plates.
- The best decomposition results when heated by microwaves under the action of high pressure entering a closed vessel, the sample splits completely, especially, this is obviously not split samples.
- The splitting of the sample takes place in a vessel with a scale and the loss of easily evaporating elements is sharply reduced, thus more accurate results are obtained.
- Fewer reagents are used, the number of empty values and the background of the sample are reduced.
- The decomposition process itself takes place in closed conditions, no pollution, does not affect the environment and human health.
- Remarkable energy saving effect, saving up to 80% of energy compared to the conventional method.
Installation of electrothermal atomization WF-1C
Technical specifications:
- Temperature range: Room temperature – 3000 °C
- Temperature control accuracy <= 1%
- Heating speed 2000 °C/sec
- Detection limit Cd <= 0.5x10–12 g, Cu <=5x10–12 g, Mo <= 1x10–12 g
- Accuracy Cd <= 3%; Cu <= 3%; Mo <= 4%
WFX-110
Method of atomic absorption spectrometry using flame oxygen-saturated air - acetylene
Oxygen saturation of air is a new method of high-temperature flame atomic absorption spectral analysis used in the WFX-110 BRAIC spectrometer (No. 29191-05 in the State Register of Measuring Instruments). It is safe for the environment and, in addition, is economical and convenient to operate.
The most common are two types of flame atomic absorption spectral methods:
1. Atomic absorption using flame air - acetylene
2. atomic absorption using flame nitrous oxide - acetylene
The flame temperature of air - acetylene is only 2300C. Therefore, AAC with an air-acetylene flame can only be used for the analysis of elements of the first group, with low melting and boiling points and an oxide dissociation energy of less than 5eV. These elements include: alkali metals, copper subgroup, zinc subgroup, as well as Mn, Fe, Co, Ni, Pb, etc.
For elements of the second group with average melting and boiling points and oxide dissociation energy approaching 5 eV, such as alkaline earth metals, Cr, Mo, Ga, Ge, Sn, etc., this method can have only limited application due to low atomization efficiency and serious chemical interference.
For the elements of the third group with high melting and boiling points and the dissociation energy of the oxide exceeding 6 eV: rare earth elements, titanium subgroup, V subgroup, as well as W, B, Al and Si, atomic absorption using flame air-acetylene is practically not used.
The flame temperature of nitrous oxide - acetylene can reach 2950C, which is 650C higher than the flame temperature of air-acetylene. Therefore, AAS based on this method is successfully used for the analysis of elements of the second group. Nitrous oxide - acetylene flame can also be used for elements of the third group with high melting and boiling points and high dissociation energy of the oxide in order to expand the analyzed range to 70 elements.
At the same time, a large amount of toxic nitrous oxide is used to maintain this type of flame (another name is laughing gas used in medicine for anesthesia). The consumption of this gas is very high, and the cost is high, it is difficult to get gas in small towns and in remote regions. The flame temperature of nitrous oxide - acetylene cannot be regulated, which does not allow achieving the best atomization efficiency for a number of elements. This flame also gives intense molecular absorption due to such a combustion product as CN, which makes highly sensitive measurements of some elements impossible.
The key point in increasing the sensitivity of the flame atomic absorption method and reducing chemical interference is an increase in the flame temperature, which is possible with an increase in the oxygen content in the air and free control of the flow rates of all gas components.
The method of atomic absorption by flame of oxygen–saturated air - acetylene is a new patented new method (Patent No. 92101560.7). Its principle is to add pure oxygen to the air and then mix with acetylene. The flow of all gases is precisely controlled by flow meters. The optimal flame mode to achieve the best atomization efficiency can also be easily set. This cheap and highly sensitive method of high-temperature flame atomic absorption spectral analysis is completely safe for health.
Since the flame temperature can be adjusted by controlling the flow rate of acetylene and oxygen (up to 3100 – 3150 C), the method is applicable for measuring various elements. For the elements of the first group, the method of spectral absorption of air – acetylene without the addition of oxygen can be directly applied. For elements of the second group, such as Ca, Sr, Ba, Eu, Yb, Mo, Ga, Sn, the sensitivity of the flame method is oxygen–saturated air – acetylene, about 10 times higher than that of the flame air – acetylene and nitrous oxide - acetylene. For the elements of the third group, the sensitivity is the same as when using nitrous oxide.
Oxygen saturation of air is a new method of high-temperature flame atomic absorption spectral analysis used in the WFX-110 BRAIC spectrometer (No. 29191-05 in the State Register of Measuring Instruments). It is safe for the environment and, in addition, is economical and convenient to operate.
The most common are two types of flame atomic absorption spectral methods:
1. Atomic absorption using flame air - acetylene
2. atomic absorption using flame nitrous oxide - acetylene
The flame temperature of air - acetylene is only 2300C. Therefore, AAC with an air-acetylene flame can only be used for the analysis of elements of the first group, with low melting and boiling points and an oxide dissociation energy of less than 5eV. These elements include: alkali metals, copper subgroup, zinc subgroup, as well as Mn, Fe, Co, Ni, Pb, etc.
For elements of the second group with average melting and boiling points and oxide dissociation energy approaching 5 eV, such as alkaline earth metals, Cr, Mo, Ga, Ge, Sn, etc., this method can have only limited application due to low atomization efficiency and serious chemical interference.
For the elements of the third group with high melting and boiling points and the dissociation energy of the oxide exceeding 6 eV: rare earth elements, titanium subgroup, V subgroup, as well as W, B, Al and Si, atomic absorption using flame air-acetylene is practically not used.
The flame temperature of nitrous oxide - acetylene can reach 2950C, which is 650C higher than the flame temperature of air-acetylene. Therefore, AAS based on this method is successfully used for the analysis of elements of the second group. Nitrous oxide - acetylene flame can also be used for elements of the third group with high melting and boiling points and high dissociation energy of the oxide in order to expand the analyzed range to 70 elements.
At the same time, a large amount of toxic nitrous oxide is used to maintain this type of flame (another name is laughing gas used in medicine for anesthesia). The consumption of this gas is very high, and the cost is high, it is difficult to get gas in small towns and in remote regions. The flame temperature of nitrous oxide - acetylene cannot be regulated, which does not allow achieving the best atomization efficiency for a number of elements. This flame also gives intense molecular absorption due to such a combustion product as CN, which makes highly sensitive measurements of some elements impossible.
The key point in increasing the sensitivity of the flame atomic absorption method and reducing chemical interference is an increase in the flame temperature, which is possible with an increase in the oxygen content in the air and free control of the flow rates of all gas components.
The method of atomic absorption by flame of oxygen–saturated air - acetylene is a new patented new method (Patent No. 92101560.7). Its principle is to add pure oxygen to the air and then mix with acetylene. The flow of all gases is precisely controlled by flow meters. The optimal flame mode to achieve the best atomization efficiency can also be easily set. This cheap and highly sensitive method of high-temperature flame atomic absorption spectral analysis is completely safe for health.
Since the flame temperature can be adjusted by controlling the flow rate of acetylene and oxygen (up to 3100 – 3150 C), the method is applicable for measuring various elements. For the elements of the first group, the method of spectral absorption of air – acetylene without the addition of oxygen can be directly applied. For elements of the second group, such as Ca, Sr, Ba, Eu, Yb, Mo, Ga, Sn, the sensitivity of the flame method is oxygen–saturated air – acetylene, about 10 times higher than that of the flame air – acetylene and nitrous oxide - acetylene. For the elements of the third group, the sensitivity is the same as when using nitrous oxide.
WFX-210
Specifications:
Innovated rich oxygen air-acetylene flame analysis method Patented flame analysis method adopting rich oxygen air-acetylene flame as substitution for nitrous oxide-dissugase flame for high temperature element analyzes, such as flame temperature Ca, Al, Ba, W, Mo, Ti, V, etc. Continuously adjustable between 2300-2950º C, which makes it possible to choose the best atomization temperature for different elements. It features easy operation, low analysis cost and wide flame analytical AAS range. The rich flame of oxygen pollute the environment and is not harmful to human bodies. It will be a breakthrough in flame AAS analysis. Integrated flame/graphite furnace atomization system, changeable with flame emission burner Automatically controlled changeover integrated flame and graphite furnace atomizer featuring easy operation and time-saving eliminates human labor.The flame emission burner head can be installed to perform flame emission analysis to alkali metals such as K, Na etc. Precise fully automated control system Automatic turret of 6 lamps, automatic regulation of the lamp flow and optimization of the position of the light beam. Automatic wavelength scanning and peak picking Automatic spectral bandwidth changing Automatic switching between flame and graphite furnace operation, automatic optimization of position parameters, automatic ignition and automatic gas flow setting Reliable fully automatic graphite furnace analysis Adopting FUZZY-PID and dual curve mode light-controlled temperature control method, temperature auto-correction method, provides fast heating, good temperature reproducibility and high analytical sensitivity. Temperature control accuracy is less than 1%. Graphite furnace with pneumatic control. The multifunctional automatic sample features automatic preparation of the standard sample, automatic correction of the sampling probe depth, automatic tracing and correction of the liquid surface height in the sample vessel, with sampling accuracy of 1% and reproducibility of 0.3%, realizing fully automation of graphite furnace analysis. Perfect safety protection measures Alarm and automatic protection to fuel gas leakage, abnormal flow, insufficient air pressure and abnormal flame extinction in flame system; Alarm and protection act to insufficient carrier gas and protective gas pressure, insufficient cooling water supply and overheating in graphite furnace system.
Innovated rich oxygen air-acetylene flame analysis method Patented flame analysis method adopting rich oxygen air-acetylene flame as substitution for nitrous oxide-dissugase flame for high temperature element analyzes, such as flame temperature Ca, Al, Ba, W, Mo, Ti, V, etc. Continuously adjustable between 2300-2950º C, which makes it possible to choose the best atomization temperature for different elements. It features easy operation, low analysis cost and wide flame analytical AAS range. The rich flame of oxygen pollute the environment and is not harmful to human bodies. It will be a breakthrough in flame AAS analysis. Integrated flame/graphite furnace atomization system, changeable with flame emission burner Automatically controlled changeover integrated flame and graphite furnace atomizer featuring easy operation and time-saving eliminates human labor.The flame emission burner head can be installed to perform flame emission analysis to alkali metals such as K, Na etc. Precise fully automated control system Automatic turret of 6 lamps, automatic regulation of the lamp flow and optimization of the position of the light beam. Automatic wavelength scanning and peak picking Automatic spectral bandwidth changing Automatic switching between flame and graphite furnace operation, automatic optimization of position parameters, automatic ignition and automatic gas flow setting Reliable fully automatic graphite furnace analysis Adopting FUZZY-PID and dual curve mode light-controlled temperature control method, temperature auto-correction method, provides fast heating, good temperature reproducibility and high analytical sensitivity. Temperature control accuracy is less than 1%. Graphite furnace with pneumatic control. The multifunctional automatic sample features automatic preparation of the standard sample, automatic correction of the sampling probe depth, automatic tracing and correction of the liquid surface height in the sample vessel, with sampling accuracy of 1% and reproducibility of 0.3%, realizing fully automation of graphite furnace analysis. Perfect safety protection measures Alarm and automatic protection to fuel gas leakage, abnormal flow, insufficient air pressure and abnormal flame extinction in flame system; Alarm and protection act to insufficient carrier gas and protective gas pressure, insufficient cooling water supply and overheating in graphite furnace system.
Features of BRAIC atomic absorption spectrometers
Patented flame analysis technology for high temperature elemental analysis
ICPS-1000-1
ISP-spectrometer for fast and automated determination of microscopic and trace concentrations of most elements of the D.I.Mendeleev table.
NANO-Viewer
Small X-ray diffractometer
D/MAX RAPID II
Microdifraction system with curved spatial detector
TTRAX III
Heavy-duty X-ray diffractometer with horizontal arrangement of the studied samples
Features of BRAIC atomic absorption spectrometers
Features of BRAIC atomic absorption spectrometers
Characteristics of BRAIC atomic absorption spectrometers
- Patented flame analysis technology using oxygen-saturated flame "air-acetylene" for high-temperature elemental analysis.
- Automatic change of hollow cathode lamps.
- Automatic replacement and selection of the optimal position of the burner.
- Automatic ignition, automatic selection of the width of the spectral range.
- Fully automated scanning and construction of spectral peaks. Automatic adjustment of the gas flow.
- Standard RS-232 interface connection.
- High safety, alarm system and automatic protection against leakage of combustible gas, lack of air pressure and abnormal flame extinguishing.
- The spray chamber is made of explosion-proof material; a titanium burner and an explosion-proof limiter are used for the flame analysis method.
- Powerful built-in microcontroller.
- Data processing and calibration under the control of a personal computer.
- Furnace analysis using
Characteristics of BRAIC atomic absorption spectrometers
- Wavelength range: 190 – 900 nm
- Wavelength accuracy: Not worse than ±0.25 nm
- Permission: Two manganese lines of 279.5 and 279.8 nm can be separated in the 0.2 nm bandwidth at a valley height of no more than 30%
- Background correction: Deuterium lamp, S-H mode, Zeeman effect
- Stability of the scan line ? 0.004 A/30 min
- 6-lamp revolver head
- Monochromator: Single-Beam Cherni-Turner
- Diffraction grating: 1800 l/mm Focal length 277 mm
- Spectral band width 0.1 nm, 0.2 nm, 0.4 nm, 1.2 nm
- FEU detector with high sensitivity and wide spectral range (Japan)
- Software: Windows operating system, automatic sensitivity correction, automatic concentration calculation, up to 20 measurements on the spectral line, automatic calculation of the mean value, standard deviation (CO) and relative CO
- Titanium burner 10 cm with one slit; titanium burner 5 cm for air with oxygen addition
- Fully plastic spray chamber
- Highly efficient glass sprayer with metal adapter •Flame air - acetylene
- Cu: Concentration <= 0.025 mg/l
- Detection threshold: <= 0.006 mg/l
- Flame oxygen-saturated air - acetylene
- Va: Concentration <= 0.22 mg/l
- Al: Concentration <= 0.4 mg/l
ICPS-1000-1
Features:
- Flexible selection of spectral lines when analyzing each element.
- High sensitivity with a detection limit of 10-8~10-10 g/ml.
- Measurement accuracy is better than 2%.
- A weakly expressed matrix effect.
- The linearity of calibration is maintained in a wide range, up to 4~5 orders of magnitude.
- Efficient software.
- RF Generator: Frequency: 40 MHz, output power 0.8kW and 1.2kW, power stability is better than 0.5%.
- Torch chamber: Cooling - closed water circuit, concentric atomizer, spray chamber - double tube, torch - vertical.
- Monochromator: Cherni-Turner system, spectral range 190 ~800 nm, focal length 1000 mm, diffraction grating 2400 l/mm, dispersion: 0.42 nm/mm (first order), minimum scanning step: 0.001 nm, resolution: 0.02 nm.
- Measurement system: mode - step-by-step accumulation, the stability of the power supply is 0.05%, the relative standard deviation is < 0.2%, IBM compatible computer.
- Software: Windows compatible interface, fast and easy operation.
- Universal package of spectral ICP analysis: creation of a control table of analysis, spectrum construction, calibration, quantitative analysis, background accounting in dynamic mode, self-testing function, etc
- Powerful management system of the built-in database
NANO-Viewer
NANO-Viewer is a small X-ray diffractometer for X-ray structural analysis at the nanoscale (XRD) manufactured by RIGAKU (Japan)
For more than 50 years, the Japanese firm Rigaku Corporation (Rigaku) has been specializing in the production of X-ray diffractometers. Thanks to its experience, innovative design solutions, and high production level, RIGAKU has become a world leader in X-ray spectrometry, diffractometry, X-ray optics, and molecular and protein crystallography. A large number of models of devices manufactured by RIGAKU allow you to choose the one that meets the user's needs as fully as possible. This is the reason for the great popularity of RIGAKU equipment all over the world.
Small–angle X-ray scattering (SAXS) is a non-destructive method for analyzing particle and pore sizes from 1 to 100 nm in various materials.
NANO-Viewer is a complex device for studying the scattering of X–rays at small angles. It consists of a microfocus X-ray generator with a rotating anti-cathode and a focusing mirror. A two-dimensional detector (Image Plate) is used to obtain information about nanoscale structures.
Thanks to nanotechnology, new materials such as genomes (proteins), semiconductor materials, high-polymer materials, environmental materials, etc. began to find application in various fields of activity. The NANO-Viewer X-ray diffraction analysis device (small-angle X-ray scattering measuring device) characterizes these advanced materials, starting from the molecular level (1 nm ~ 100 nm macrostructure) and ending with the atomic level (0.2 nm ~ 1 nm microstructure).
For more than 50 years, the Japanese firm Rigaku Corporation (Rigaku) has been specializing in the production of X-ray diffractometers. Thanks to its experience, innovative design solutions, and high production level, RIGAKU has become a world leader in X-ray spectrometry, diffractometry, X-ray optics, and molecular and protein crystallography. A large number of models of devices manufactured by RIGAKU allow you to choose the one that meets the user's needs as fully as possible. This is the reason for the great popularity of RIGAKU equipment all over the world.
Small–angle X-ray scattering (SAXS) is a non-destructive method for analyzing particle and pore sizes from 1 to 100 nm in various materials.
NANO-Viewer is a complex device for studying the scattering of X–rays at small angles. It consists of a microfocus X-ray generator with a rotating anti-cathode and a focusing mirror. A two-dimensional detector (Image Plate) is used to obtain information about nanoscale structures.
Thanks to nanotechnology, new materials such as genomes (proteins), semiconductor materials, high-polymer materials, environmental materials, etc. began to find application in various fields of activity. The NANO-Viewer X-ray diffraction analysis device (small-angle X-ray scattering measuring device) characterizes these advanced materials, starting from the molecular level (1 nm ~ 100 nm macrostructure) and ending with the atomic level (0.2 nm ~ 1 nm microstructure).
D/MAX RAPID II
D/MAX RAPID II is an X-ray microdifraction (XRD) system with a curved spatial detector (two-dimensional X-ray diffractometer) manufactured by RIGAKU (Japan)
For more than 50 years, the Japanese firm Rigaku Corporation (Rigaku) has been specializing in the production of X-ray diffractometers. Thanks to its experience, innovative design solutions, and high production level, RIGAKU has become a world leader in X-ray spectrometry, diffractometry, X-ray optics, and molecular and protein crystallography. A large number of models of devices manufactured by RIGAKU allow you to choose the one that meets the user's needs as fully as possible. This is the reason for the great popularity of RIGAKU equipment all over the world.
D/MAX RAPID II is a diffractometer for solving a wide range of tasks: powder diffractometry, microdifraction, X–ray scattering at large angles, analysis of structure and residual stresses and investigation of the structure of single crystals. The diffractometer is equipped with a curved two-dimensional detector (Image Plate) and two types of tubes: 3 kW or high-intensity 1.2 kW.
The ability to analyze samples from 10 microns in size makes this system ideal for non-destructive identification of small particles in various samples. D/MAX RAPID II is equipped with a CCD camera with the possibility of magnification, which allows you to get an image of the sample area from 1 micron.
XY mapping allows you to determine the exact location of inclusions in large samples.
Fields of application – geology, process control in semiconductors, forensic medicine, etc.
For more than 50 years, the Japanese firm Rigaku Corporation (Rigaku) has been specializing in the production of X-ray diffractometers. Thanks to its experience, innovative design solutions, and high production level, RIGAKU has become a world leader in X-ray spectrometry, diffractometry, X-ray optics, and molecular and protein crystallography. A large number of models of devices manufactured by RIGAKU allow you to choose the one that meets the user's needs as fully as possible. This is the reason for the great popularity of RIGAKU equipment all over the world.
D/MAX RAPID II is a diffractometer for solving a wide range of tasks: powder diffractometry, microdifraction, X–ray scattering at large angles, analysis of structure and residual stresses and investigation of the structure of single crystals. The diffractometer is equipped with a curved two-dimensional detector (Image Plate) and two types of tubes: 3 kW or high-intensity 1.2 kW.
The ability to analyze samples from 10 microns in size makes this system ideal for non-destructive identification of small particles in various samples. D/MAX RAPID II is equipped with a CCD camera with the possibility of magnification, which allows you to get an image of the sample area from 1 micron.
XY mapping allows you to determine the exact location of inclusions in large samples.
Fields of application – geology, process control in semiconductors, forensic medicine, etc.
TTRAX III
TTRAX III is a heavy-duty X-ray diffractometer (XRD) with a horizontal arrangement of the test sample m with a horizontal arrangement of the test sample manufactured by RIGAKU (Japan)
For more than 50 years, the Japanese firm Rigaku Corporation (Rigaku) has been specializing in the production of X-ray diffractometers. Thanks to its experience, innovative design solutions, and high production level, RIGAKU has become a world leader in X-ray spectrometry, diffractometry, X-ray optics, and molecular and protein crystallography. A large number of models of devices manufactured by RIGAKU allow you to choose the one that meets the user's needs as fully as possible. This is the reason for the great popularity of RIGAKU equipment all over the world.
TTRAX III is a Theta – Theta diffractometer with a powerful X–ray tube with a rotating anode. TTRAX III is the most powerful Theta – Theta X–ray diffractometer in the world. A distinctive feature of the system is an 18 kW rotating anode, with which the tasks of determining the phases of small concentrations and studying thin films are easily solved. To ensure the solution of various tasks without additional system configuration, a convenient Theta – Theta goniometer design was used in combination with parallel beam optics (Cross Beam Optical technology, SVO) and an independent axis for diffraction analysis in the sample plane.
For more than 50 years, the Japanese firm Rigaku Corporation (Rigaku) has been specializing in the production of X-ray diffractometers. Thanks to its experience, innovative design solutions, and high production level, RIGAKU has become a world leader in X-ray spectrometry, diffractometry, X-ray optics, and molecular and protein crystallography. A large number of models of devices manufactured by RIGAKU allow you to choose the one that meets the user's needs as fully as possible. This is the reason for the great popularity of RIGAKU equipment all over the world.
TTRAX III is a Theta – Theta diffractometer with a powerful X–ray tube with a rotating anode. TTRAX III is the most powerful Theta – Theta X–ray diffractometer in the world. A distinctive feature of the system is an 18 kW rotating anode, with which the tasks of determining the phases of small concentrations and studying thin films are easily solved. To ensure the solution of various tasks without additional system configuration, a convenient Theta – Theta goniometer design was used in combination with parallel beam optics (Cross Beam Optical technology, SVO) and an independent axis for diffraction analysis in the sample plane.
SmartLab
X-ray diffractometer for the characterization of thin films with a horizontal arrangement of the measured sample
Ultima IV
Multi-purpose X-ray diffractometer with a horizontal arrangement of the test sample
MiniFlex II
Desktop diffractometer with an optimal price–quality ratio
SensoPRO
Quality control software
FSAS III
X-ray diffraction system for determining the orientations of single crystals
SensoMAP
The software is designed for measuring the dimensions and parameters of surfaces
Plu CP
Optical profiler for fast optical analysis of large samples
2991F2
X-ray system for determining the orientations of single crystals
Plu NEOX
3D Optical profilometer. Combines the capabilities of confocal and interferometric profilometry
APEX
Aspherical optical profilometer capable of measuring any optical surfaces
SmartLab
The main theses of this concept:
- a polysyllabic experiment should not mean the complexity of its implementation;
- an operator who, for example, measures the thickness of a thin film is not required to understand the reflectivity of X-rays;
- or, a specialist in the field of soil mineralogy is not required to know all the subtleties of the Ritveld refinement.
smartLAB, enhanced by the Guidance™ software package Rigaku has implemented intelligent specialized protocols in all types of measurements, thereby increasing the capabilities of an insufficiently experienced user in obtaining a high-quality analysis result with a minimum of pre-training and training costs. And for sophisticated users, smartLAB with its full automation of implemented methods has become the key to maximum productivity and productivity.
CBO technology: modularity without modules
smartLAB is equipped as standard with a patented Rigaku “Cross Beam Optics" (CBO) technical solution. The optics assembled in one SV node opens up the possibility of simultaneous use of two focusing schemes: a divergent (according to Bragg-Brentano) and a parallel beam. The user can easily switch to one or another geometry by simply turning the optical module without the need for any other reconfiguration of the optical components.
- a polysyllabic experiment should not mean the complexity of its implementation;
- an operator who, for example, measures the thickness of a thin film is not required to understand the reflectivity of X-rays;
- or, a specialist in the field of soil mineralogy is not required to know all the subtleties of the Ritveld refinement.
smartLAB, enhanced by the Guidance™ software package Rigaku has implemented intelligent specialized protocols in all types of measurements, thereby increasing the capabilities of an insufficiently experienced user in obtaining a high-quality analysis result with a minimum of pre-training and training costs. And for sophisticated users, smartLAB with its full automation of implemented methods has become the key to maximum productivity and productivity.
CBO technology: modularity without modules
smartLAB is equipped as standard with a patented Rigaku “Cross Beam Optics" (CBO) technical solution. The optics assembled in one SV node opens up the possibility of simultaneous use of two focusing schemes: a divergent (according to Bragg-Brentano) and a parallel beam. The user can easily switch to one or another geometry by simply turning the optical module without the need for any other reconfiguration of the optical components.
Ultima IV
The RIGAKU Ultima IV diffractometer is a new development of Rigaku. To date, it is the only diffractometer with a fully automatic goniometer adjustment function. The Rigaku Ultima IV diffractometer implements all currently possible options and prefixes for diffractometers to solve a wide range of tasks.
Rigaku Company presented its new Ultima IV model for the first time at the X-Ray Conference in Denver, which once again proved to the public the speed of its reaction, as a manufacturing company, to follow the latest trends in materials research and even outstrip them. Thus, a revolutionary step in the development of the hardware capabilities of modern diffractometers was the introduction of the methods of SAXS, small-angle X-ray scattering, and in-plane, in-plane analysis, into the standard configuration of the q/q diffractometer. Now there is no need to buy two devices or take risks with a synchrotron to solve such tasks.
Rigaku Company presented its new Ultima IV model for the first time at the X-Ray Conference in Denver, which once again proved to the public the speed of its reaction, as a manufacturing company, to follow the latest trends in materials research and even outstrip them. Thus, a revolutionary step in the development of the hardware capabilities of modern diffractometers was the introduction of the methods of SAXS, small-angle X-ray scattering, and in-plane, in-plane analysis, into the standard configuration of the q/q diffractometer. Now there is no need to buy two devices or take risks with a synchrotron to solve such tasks.
MiniFlex II
Miniflex II is a desktop diffractometer with an optimal price–quality ratio. This diffractometer is a new standard for universities, research institutes and other laboratories wishing to add X–ray diffractometry capabilities to existing research methods. Miniflex II has low power consumption, small size and low cost.
The unique sealed layout allows for easy transportation and easy installation. The portability of the Miniflex II diffractometer and its minimal requirements for tube cooling and power supply make this system applicable in the oil and gas, mining, construction and many other industries.
Thanks to the latest changes, Miniflex II allows obtaining diffractograms with a high signal-to-noise ratio using a monochromator and a new detector with a large input aperture. Miniflex II provides results comparable to those for large, expensive X-ray systems.
The unique sealed layout allows for easy transportation and easy installation. The portability of the Miniflex II diffractometer and its minimal requirements for tube cooling and power supply make this system applicable in the oil and gas, mining, construction and many other industries.
Thanks to the latest changes, Miniflex II allows obtaining diffractograms with a high signal-to-noise ratio using a monochromator and a new detector with a large input aperture. Miniflex II provides results comparable to those for large, expensive X-ray systems.
SensoPRO
Industrial Metrology
Industrial metrological control has never been so simple. Thanks to the SensoPRO software and PLu CP series optical profilometers, the production line operator only needs to load samples for inspection into the installation and follow the instructions of the program. The SensoPRO program is directly connected to the software part of the Sensofar optical profilometers. Using a programmatically defined algorithm, PLu CP collects data in 3D mode and transmits it to SensoPRO. Having received the data, SensoPRO performs the necessary calculations in accordance with the selected mode (algorithm) and parameters. There are several standard algorithms for analyzing surfaces, for example, for analyzing chip housings in the semiconductor industry. Of course, there is the possibility of creating new algorithms and setting parameters for atypical production processes.
Industrial metrological control has never been so simple. Thanks to the SensoPRO software and PLu CP series optical profilometers, the production line operator only needs to load samples for inspection into the installation and follow the instructions of the program. The SensoPRO program is directly connected to the software part of the Sensofar optical profilometers. Using a programmatically defined algorithm, PLu CP collects data in 3D mode and transmits it to SensoPRO. Having received the data, SensoPRO performs the necessary calculations in accordance with the selected mode (algorithm) and parameters. There are several standard algorithms for analyzing surfaces, for example, for analyzing chip housings in the semiconductor industry. Of course, there is the possibility of creating new algorithms and setting parameters for atypical production processes.
FSAS III
FSAS III - X-ray diffraction system for determining the orientations of single crystals "RIGAKU" (Japan), determining the orientation of ingots, plates (silicon, A3B5, sapphire, quartz, etc.)
X-ray diffraction system for determining the orientations of single crystals Rigaku FSAS III.
Automatic determination of orientations of single crystals of silicon, germanium, gallium arsenide, quartz, sapphire, etc.
The data can be transmitted to an automatic cutting machine for cutting in the desired plane.
Reliable locking of the system doors from opening during analysis.
Features of the model:
The installation includes :
X-ray diffraction system for determining the orientations of single crystals Rigaku FSAS III.
Automatic determination of orientations of single crystals of silicon, germanium, gallium arsenide, quartz, sapphire, etc.
The data can be transmitted to an automatic cutting machine for cutting in the desired plane.
Reliable locking of the system doors from opening during analysis.
Features of the model:
- measurement accuracy + 30”, -30” (0.012 degrees)
- dimensions and weight 1300x780x1600 mm, 400 kg
- X-ray protection closed casing
The installation includes :
- X–ray generator
- X–ray tube target material – copper
- X–ray tube cooling system - air cooling with a fan
- maximum nominal operating mode - tube voltage: 30 kV (fixed),
- tube current: up to 1 mA (adjustable)
- detection system: scitillation counter
- goniometer (measuring angle range - Teta 0-50 degrees
- Control from the built-in computer
SensoMAP
SensoMAP is a software product based on the technology "Mountains Technology®" of the company "Digital Surf". This software runs under Windows OS and is designed for measuring the dimensions and parameters of surfaces. This software has been used for 10 years and is recognized by many manufacturers of metrological equipment, and more than 2,000 researchers and metrologists around the world. This software package is characterized by ease of use, high performance and stability. SensoMAP is designed to automatically work with the hardware of any of the profilometers of the PLu series. SensoMAP program modules are designed for each of the surface metrology sectors:
SensoMAP standard is a module for basic versatile analysis in 2D and 3D measurements
SensoMAP FFT - module for analysis using Fourier transforms in topographic measurements
SensoMAP Plus is a module for advanced profilometric analysis, including texture, volume and a large list of other parameters
SensoMAP Turbo is a module for the most complete analysis, including binarization, structure analysis modules, FFT modules and others.
SensoMAP is the result of more than ten years of research and innovation. This is the first program in which the principle of marking the analytical field of the program was laid down. Manufacturers of other metrological software often copy the functions of the SensoMAP program, but no such program surpasses the SensoMAP level in its indicators. It combines deep knowledge and the scientific path traversed in the process of its creation.
Instructions in 6 languages are supplied with this software.
SensoMAP standard is a module for basic versatile analysis in 2D and 3D measurements
SensoMAP FFT - module for analysis using Fourier transforms in topographic measurements
SensoMAP Plus is a module for advanced profilometric analysis, including texture, volume and a large list of other parameters
SensoMAP Turbo is a module for the most complete analysis, including binarization, structure analysis modules, FFT modules and others.
SensoMAP is the result of more than ten years of research and innovation. This is the first program in which the principle of marking the analytical field of the program was laid down. Manufacturers of other metrological software often copy the functions of the SensoMAP program, but no such program surpasses the SensoMAP level in its indicators. It combines deep knowledge and the scientific path traversed in the process of its creation.
Instructions in 6 languages are supplied with this software.
Plu CP
The PLu series for product control is specially designed for fast optical analysis of large samples, such as printed circuit boards, flip-chip devices and other purposes. Based on the well-proven optical profiling technology, you can analyze any surface using the interferometric method (PLu 4300 CP) or a combination of interferometric and confocal methods (PLu 2300 CP). The device is made using a granite platform and allows you to place samples up to 610x610 mm in size. A large number of different types of clips and sample holders makes it possible to measure various samples: from large printed circuit boards to several flip-chip cases.
Specifications:
Specifications:
- Large sample size: up to 610 x 610 mm
- Fast and reliable method of measurement and analytics in 3D
- Fully automatic data collection and analysis system
- The highest arbitrariness for production control
2991F2
2991F2 - X-ray diffraction system for determining the orientations of single crystals "RIGAKU" (Japan), determining the orientation of ingots, plates (silicon, A3B5, sapphire, quartz, etc.)
X-ray diffraction system for determining the orientations of single crystals "RIGAKU" (Model 2991F2)
Model Features:
X-ray diffraction system for determining the orientations of single crystals "RIGAKU" (Model 2991F2)
Model Features:
- Measurement accuracy + 30”, -30”
- Dimensions and weight - 1296x726x1514 mm, 300 kg
- X-ray protection closed casing
- The power supply of the installation is 100 V, 15 A, 50/60 Hz)
Plu NEOX
Sensofar is pleased to present you the new Neox optical 3D profilometer. This profilometer is a breakthrough in the field of contactless optical 3D profilometry. It combines the capabilities of confocal and interferometric profilometry. The combination of these two methods makes Neox a unique system that surpasses the existing optical profilometers in its parameters.
Neox is designed to obtain fast non-invasive measurements of micro and nano-geometry of surfaces of various configurations. This system with dual sensor technology is very convenient for scientific research and laboratory quality analysis.
Based on micro-display technology, Neox allows fast confocal scanning at up to 12.5 frames per second. Thanks to the use of technology with no moving parts, compact size and reliable modular design, Neox is an excellent analytical tool.
Optionally, Neox can be equipped with a spectroscopic reflectometer to enable the measurement of thin films. It is possible to measure up to 10 layers of films in the range up to 10 nm.
Neox has a measurement discreteness from 0.1 nm to several nm, is equipped with a double vertical scanner that works in combination with a precision movable table and a piezo scanner. This makes it possible to achieve the highest accuracy and repeatability of measurements among the devices on the market today.
Highly efficient illumination and high contrast algorithm are ideal for angular measurement of surfaces with slope steepness of more than 70°. It is possible to make measurements of roughly processed and reflective surfaces, as well as samples containing dissimilar materials.
Neox uses high-resolution black and white, high-speed CCD cameras as a metrological detector and a color camera for examining surfaces in bright light and creating 3D measurement models.
Neox is designed to obtain fast non-invasive measurements of micro and nano-geometry of surfaces of various configurations. This system with dual sensor technology is very convenient for scientific research and laboratory quality analysis.
Based on micro-display technology, Neox allows fast confocal scanning at up to 12.5 frames per second. Thanks to the use of technology with no moving parts, compact size and reliable modular design, Neox is an excellent analytical tool.
Optionally, Neox can be equipped with a spectroscopic reflectometer to enable the measurement of thin films. It is possible to measure up to 10 layers of films in the range up to 10 nm.
Neox has a measurement discreteness from 0.1 nm to several nm, is equipped with a double vertical scanner that works in combination with a precision movable table and a piezo scanner. This makes it possible to achieve the highest accuracy and repeatability of measurements among the devices on the market today.
Highly efficient illumination and high contrast algorithm are ideal for angular measurement of surfaces with slope steepness of more than 70°. It is possible to make measurements of roughly processed and reflective surfaces, as well as samples containing dissimilar materials.
Neox uses high-resolution black and white, high-speed CCD cameras as a metrological detector and a color camera for examining surfaces in bright light and creating 3D measurement models.
APEX
Plu Apex is an optical profilometer capable of measuring any optical surfaces – from aspherical to flat, as well as surfaces of arbitrary shape. This is especially useful when measuring optics. Sensofar's innovative development – confocal tracking technology allows for very fast and accurate measurements at speeds up to 1 mm/sec.
PLu Apex is equipped with a high-precision slide table on pneumatic bearings and comes with powerful software that allows you to quickly get accurate measurement results.
The new Plu Apex is also able to meet the highest metrological requirements when measuring large samples – the measurement range in the horizontal plane is up to 100 mm (500 mm is optional) and up to 50 mm in the vertical, as well as angular measurements up to 65 degrees.
The contactless measurement method plays a major role in measurements made in the optical industry. This method is used in the mass production of lenses for Blu-ray and DVD, cell phones, lenses for digital photo and video cameras, lenses of video projectors. This is especially important when measuring astronomical equipment, optical data carriers and in photolithography.
PLu Apex is equipped with a high-precision slide table on pneumatic bearings and comes with powerful software that allows you to quickly get accurate measurement results.
The new Plu Apex is also able to meet the highest metrological requirements when measuring large samples – the measurement range in the horizontal plane is up to 100 mm (500 mm is optional) and up to 50 mm in the vertical, as well as angular measurements up to 65 degrees.
The contactless measurement method plays a major role in measurements made in the optical industry. This method is used in the mass production of lenses for Blu-ray and DVD, cell phones, lenses for digital photo and video cameras, lenses of video projectors. This is especially important when measuring astronomical equipment, optical data carriers and in photolithography.
Mini cartridge for ventilation lines of gas distribution devices of the CLEANVENT series
Mini cartridge for ventilation lines of gas distribution devices
Safety device against gas leakage CLEAN-PROTECT
The CLEAN-PROTECT device is designed to absorb toxic or other dangerous gases during an emergency gas release
CLEANSORB® PRIMELINE series of devices
It is used to work with gas flows and related processes in systems with increased safety requirements
CLEANSORB® FABLINE series of devices
It is used for the removal of waste gases throughout the enterprise
CLEANSORB® LABLINE series of devices
It is distinguished by the small size of the absorption column installed in a compact cabinet with the possibility of removing air
CLEANSORB® series of autonomous devices
They are used in small research laboratories or with autonomous absorption columns to remove the remaining gases at the outlet of experimental chambers
Mini cartridge for ventilation lines of gas distribution devices of the CLEANVENT series
Before installing a new gas cylinder in line with the gas distribution device of the gas supply system, it is necessary to remove the process gas remaining from the previous gas cylinder. This is done both for safety reasons and to ensure the continuity of fresh gas supply. The residual gas may turn out to be a highly concentrated toxic, self-igniting or aggressive gas, which poses a significant safety risk.
The safety of the solution for removing dangerous purge gases using the CLEANVENT cartridge has been proven by more than 20 years of experience. When installed inside the gas distribution device on the suction side of a vacuum generator with a Venturi tube or inside the gas distribution cabinet, the CLEANVENT cartridge provides the possibility of cleaning residual gases "at source".
The gases to be cleaned are pumped out through the absorber layer in the cartridge and are cleaned of dangerous gases during irreversible chemical conversion to the solid phase. CLEANVENT rechargeable cartridges are available for use with a wide range of special gases, they are supported by the global network of CS CLEAN SYSTEMS service partners.
The safety of the solution for removing dangerous purge gases using the CLEANVENT cartridge has been proven by more than 20 years of experience. When installed inside the gas distribution device on the suction side of a vacuum generator with a Venturi tube or inside the gas distribution cabinet, the CLEANVENT cartridge provides the possibility of cleaning residual gases "at source".
The gases to be cleaned are pumped out through the absorber layer in the cartridge and are cleaned of dangerous gases during irreversible chemical conversion to the solid phase. CLEANVENT rechargeable cartridges are available for use with a wide range of special gases, they are supported by the global network of CS CLEAN SYSTEMS service partners.
Safety device against gas leakage CLEAN-PROTECT
The CLEAN-PROTECT device is designed to absorb toxic or other dangerous gases in the event of an emergency gas release. This safety device provides protection against uncontrolled release of toxic, aggressive or self-igniting gases from one or more gas distribution devices of the gas supply system, thus ensuring the protection of industrial premises and the area adjacent to the plant.
The core of the CLEAN-PROTECT system is the CLEANSORB® dry chemosorbent. In the CLEAN-PROTECT system, the emitted gases undergo an irreversible chemical reaction (oxidation or neutralization), as a result of which they are safely converted into solid by-products. Such a system is integrated into the air outlet circuit and does not require power supply or other type of devices for its operation. This means that the system is constantly in the ready-to-work mode.
The CLEAN-PROTECT system is made of high-quality 316L stainless steel. In the absence of accidental gas emissions, the frequency of replacement of the absorber layer is five years.
The core of the CLEAN-PROTECT system is the CLEANSORB® dry chemosorbent. In the CLEAN-PROTECT system, the emitted gases undergo an irreversible chemical reaction (oxidation or neutralization), as a result of which they are safely converted into solid by-products. Such a system is integrated into the air outlet circuit and does not require power supply or other type of devices for its operation. This means that the system is constantly in the ready-to-work mode.
The CLEAN-PROTECT system is made of high-quality 316L stainless steel. In the absence of accidental gas emissions, the frequency of replacement of the absorber layer is five years.
CLEANSORB® PRIMELINE series of devices
The PRIMELINE series is a fully functional modification of the CLEANSORB family of dry exhaust gas scrubbers. This system has been specially designed to work with gas flows and related processes in systems with increased safety requirements, in particular, with the processes of chemical vapor deposition of organometallic compounds (MOCVD).
The key element of ensuring the safety of the PRIMELINE system is the filler of the absorption column. The specialized CLEANSORB® chemisorbent filler provides highly effective removal of toxic gases such as AsH3, PH3 or GeH4, while minimizing the risks associated with side reactions of hydrogen or air ingress. Unique monitoring and control functions, including an infrared array for monitoring the temperature profile in the absorption column, as well as an inert gas cooling mechanism. Another distinctive feature of the PRIMELINE system is the backup absorption column, which increases the level of safety, while simultaneously increasing the uptime of the system and the productivity of the customer's equipment.
The PRIMELINE series includes three models (CS070PS, CS100PS and CS200PS) with different column sizes, meeting a wide range of requests from performing critical operations in research and development to the stringent requirements of high-tech production lines.
The key element of ensuring the safety of the PRIMELINE system is the filler of the absorption column. The specialized CLEANSORB® chemisorbent filler provides highly effective removal of toxic gases such as AsH3, PH3 or GeH4, while minimizing the risks associated with side reactions of hydrogen or air ingress. Unique monitoring and control functions, including an infrared array for monitoring the temperature profile in the absorption column, as well as an inert gas cooling mechanism. Another distinctive feature of the PRIMELINE system is the backup absorption column, which increases the level of safety, while simultaneously increasing the uptime of the system and the productivity of the customer's equipment.
The PRIMELINE series includes three models (CS070PS, CS100PS and CS200PS) with different column sizes, meeting a wide range of requests from performing critical operations in research and development to the stringent requirements of high-tech production lines.
CLEANSORB® FABLINE series of devices
FABLINE is a standard CLEANSORB model for the removal of waste gases throughout the enterprise. Available in three column sizes, this system adapts easily to the requirements of both control lines and full-scale production lines. CLEANSORB products enjoy an enviable reputation for their durability and reliability even in the harshest technological conditions, which is confirmed by 25 years of operating experience on several thousand production lines around the world. FABLINE products are made of corrosion-resistant 316L stainless steel and high-quality reliable components.
Made on the basis of the proprietary CLEANSORB® chemosorbent from CS CLEAN SYSTEMS, FABLINE products are the ideal choice for the widest range of applications, including the following. Plasma etching, chemical deposition (CVD), atomic layer deposition (SLA), ion implantation and manufacture of solar cells based on copper-indium-gallium diselenide.
Made on the basis of the proprietary CLEANSORB® chemosorbent from CS CLEAN SYSTEMS, FABLINE products are the ideal choice for the widest range of applications, including the following. Plasma etching, chemical deposition (CVD), atomic layer deposition (SLA), ion implantation and manufacture of solar cells based on copper-indium-gallium diselenide.
CLEANSORB® LABLINE series of devices
The CLEANSORB LABLINE series is distinguished by the small size of the absorption column installed in a compact cabinet with the possibility of removing air.
The possibility of passive chemisorption of hazardous gases at ambient temperature is an additional advantage for irregular laboratory work, since the LABLINE system will always be ready for operation, without requiring preheating or other activation with each new experiment.
The wide selective ability of CLEANSORB® chemosorbent to a wide variety of gaseous and liquid starting reagents, from aggressive and toxic compounds to organometallic complexes of the latest generation, provides ideal flexibility when performing research work. The LABLINE system is also widely used to remove hazardous purge gases from combined purge and exhaust lines of gas distribution devices.
The front control panel provides the user with the ability to interact with the system and displays important operational parameters, such as inlet pressure and detector status at the outlet of the tank. Potential-free contacts enable remote monitoring or blocking of system parameters using external protection hardware.
The possibility of passive chemisorption of hazardous gases at ambient temperature is an additional advantage for irregular laboratory work, since the LABLINE system will always be ready for operation, without requiring preheating or other activation with each new experiment.
The wide selective ability of CLEANSORB® chemosorbent to a wide variety of gaseous and liquid starting reagents, from aggressive and toxic compounds to organometallic complexes of the latest generation, provides ideal flexibility when performing research work. The LABLINE system is also widely used to remove hazardous purge gases from combined purge and exhaust lines of gas distribution devices.
The front control panel provides the user with the ability to interact with the system and displays important operational parameters, such as inlet pressure and detector status at the outlet of the tank. Potential-free contacts enable remote monitoring or blocking of system parameters using external protection hardware.
CLEANSORB® series of autonomous devices
Self-contained CLEANSORB devices can be used in small research laboratories or with self-contained absorption columns to remove the remaining gases at the outlet of the experimental chambers. Several safety components are available as additional equipment, including cabinets with the ability to remove air, as well as pressure monitoring and exhaust gas detection devices.
The possibility of passive chemisorption of hazardous gases at ambient temperature is an additional advantage for irregular laboratory work, since the compact—sized absorber will always be ready for operation, without requiring preheating or other activation with each new experiment.
The possibility of passive chemisorption of hazardous gases at ambient temperature is an additional advantage for irregular laboratory work, since the compact—sized absorber will always be ready for operation, without requiring preheating or other activation with each new experiment.
HYM Co., Ltd (China)
Multi-wire cutting
Centrifuge, SP-12;
Application of photoresist, polyimides, lacquers, metal-organics, alloying impurities, most organic substances and liquids
Centrifuge, SP-6
Application of photoresist, polyimides, lacquers, metal-organics, alloying impurities, most organic substances and liquids.
Centrifuge, SP-4
Application of photoresist, polyimides, lacquers, metal-organics, alloying impurities, most organic substances and liquids
S-200 semi-automatic
Combination and exposure system
P-150 with manual control
Alignment and exposure systems
Centrifuge, SP-12;
Application of photoresist, polyimides, lacquers, metal-organics, alloying impurities, most organic substances and liquids.
Specifications:
Specifications:
- Substrate size: up to 12";
- Rotation speed :100 - 6000 rpm;
- 8.4" touch screen
- AC servo motor
- 20 recipes in 10 steps
Centrifuge, SP-6
Application of photoresist, polyimides, lacquers, metal-organics, alloying impurities, most organic substances and liquids.
- Substrate size : up to 6";
- Rotation speed: 100 - 6000 rpm;
- 7" touch screen
- BLDC motor.
- 20 recipes in 10 steps
Centrifuge, SP-4
Application of photoresist, polyimides, lacquers, metal-organics, alloying impurities, most organic substances and liquids
- Substrate size: up to 4";
- Rotation speed: 100 - 6000 rpm /
- 5" touch screen
- BLDC motor.
- 20 recipes in 10 steps
S-200 semi-automatic
- Mask size: up to 7" × 7" / 14" × 14";
- Substrate size: up to Ø 6" /
- Ø 12";
- UV light source: 350-2000W;
- Alignment accuracy: 1 micron
P-150 with manual control
- Mask size: up to 5" × 5" / 7" × 7";
- Substrate size: up to Ø 100 mm / Ø 150 mm;
- UV light source: 350W/500W/1000W;
- Alignment accuracy: 1 micron.
Exposure System
Exposure systems (illumination)
AC 1500-P3/AC 2000-P2
Double-sided plate grinding and polishing machines
AC microLine
Double-sided plate grinding and polishing machines
LAPMASTER WOLTERS 3R/4R
Single-disc machines for single-sided grinding
MWS FS-6300D
Wire Cutting machines
Installations of group heat treatment of plates
Installations of group heat treatment of plates
AC 1500-P3/AC 2000-P2
AC 1500-P3 / AC 2000-P2 is a new generation in the technology of high-precision double-sided grinding and polishing of plates (double sided machine - DSM):
High-performance double-sided grinding and polishing machines (double wheel machines or double sided machines) of the AC microLine series have a progressive design and construction. The modular system of the main components together with control accuracy, measuring tools and technologies show the highest reliability and reproducibility of processing processes and make the systems convenient to work with. The machines and systems have sound-absorbing cladding and protection of the processing area, which gives excellent accessibility and excellent safety at work. For automatic loading and unloading of parts (plates), the upper disk is designed as a rotary-folding.
New machines from the AC microLine AC 1500-P3 and AC 2000-P2 series from Peter Wolters are setting new standards in polishing semiconductor wafers. The basics of the AC 2000-P2 machine are based on more than 4 decades of experience in the development of machines for grinding and polishing plates. The AC 1500-P3 and AC 2000-P2 machines from Peter Wolters have become today the world standard in the double-sided processing of plates with a diameter of 200 and 300 mm.
High-performance double-sided grinding and polishing machines (double wheel machines or double sided machines) of the AC microLine series have a progressive design and construction. The modular system of the main components together with control accuracy, measuring tools and technologies show the highest reliability and reproducibility of processing processes and make the systems convenient to work with. The machines and systems have sound-absorbing cladding and protection of the processing area, which gives excellent accessibility and excellent safety at work. For automatic loading and unloading of parts (plates), the upper disk is designed as a rotary-folding.
New machines from the AC microLine AC 1500-P3 and AC 2000-P2 series from Peter Wolters are setting new standards in polishing semiconductor wafers. The basics of the AC 2000-P2 machine are based on more than 4 decades of experience in the development of machines for grinding and polishing plates. The AC 1500-P3 and AC 2000-P2 machines from Peter Wolters have become today the world standard in the double-sided processing of plates with a diameter of 200 and 300 mm.
AC microLine
High-performance double-sided grinding and polishing machines (double wheel machines or double sided machines) of the AC microLine series have a progressive design and construction. The modular system of the main components together with control accuracy, measuring tools and technologies show the highest reliability and reproducibility of processing processes and make the systems convenient to work with. The machines and systems have sound-absorbing cladding and protection of the processing area, which gives excellent accessibility and excellent safety at work. For automatic loading and unloading of parts (plates), the upper disk is designed as a rotary-folding.
On the machines of the AC microLine series, it is possible to process samples of various shapes, i.e. round (for example, n/a plates, glass plates, etc.), rectangular or non-standard shapes and process both the entire surface of the sample and a separate segment or section of the surface. Depending on the geometry of the sample, it is possible to achieve tolerances in micrometers and even lower (submicron tolerances when processing plates).
The AC microLine series machines are the ideal solution for processing thin and brittle samples, such as glass, semiconductor wafers: silicon wafers, plates made of A3B5 structures (GaAs, GaN, etc.), plates made of sapphire, ceramics, etc. The processing method and process is simple, flexible and productive. During processing (grinding or polishing), the samples are easily fixed in the sample holders (workpiece carriers) and are therefore free from internal stresses, which makes it possible to process such fragile samples as semiconductor wafers. Reliability, reliability, low cost of using the machine, many possibilities for the application and automation of the machine and processing processes make the machines of the series an ideal solution for double-sided grinding and are the main features of all Peter Wolters systems.
On the machines of the AC microLine series, it is possible to process samples of various shapes, i.e. round (for example, n/a plates, glass plates, etc.), rectangular or non-standard shapes and process both the entire surface of the sample and a separate segment or section of the surface. Depending on the geometry of the sample, it is possible to achieve tolerances in micrometers and even lower (submicron tolerances when processing plates).
The AC microLine series machines are the ideal solution for processing thin and brittle samples, such as glass, semiconductor wafers: silicon wafers, plates made of A3B5 structures (GaAs, GaN, etc.), plates made of sapphire, ceramics, etc. The processing method and process is simple, flexible and productive. During processing (grinding or polishing), the samples are easily fixed in the sample holders (workpiece carriers) and are therefore free from internal stresses, which makes it possible to process such fragile samples as semiconductor wafers. Reliability, reliability, low cost of using the machine, many possibilities for the application and automation of the machine and processing processes make the machines of the series an ideal solution for double-sided grinding and are the main features of all Peter Wolters systems.
LAPMASTER WOLTERS 3R/4R
3R-600 - 4R-1200 machines are machines for processing medium and large samples in mass production. These machines are offered with options: speed control, pneumatic loading system and cooling of the grinding disc. The supply of consumables and spare parts is carried out in a short time.
MWS FS-6300D
FS-6300D series model with a lower cutting mechanism:
OKSANA FS-6300D is a multi-wire cutting system that combines the latest technologies to increase productivity, cutting accuracy and overall working efficiency. In the FS-6300D series of machines, wire feeding and removal is provided directly, which ensures control of the wire tension accuracy and high wire movement speed using the servo motor torque control system. The system is designed to work with materials such as silicon carbide, sapphire, ceramics, ferrites, glasses, quartz, silicon, as well as with a variety of superhard and brittle materials, in the processing of which the determining factors are cutting accuracy and minimal losses.
The lower location of the cutting mechanism. The workpiece is fed from above.
Sawing takes place by elliptical movement of the cutting mechanism (swing + translational movement of the wire upwards) .
High wire movement speed and high cutting speed.
The wire tension accuracy is controlled by a servo motor and a tension sensor
Constant wire tension and stable wire feed control
Automatic wire winding.
Powerful motor (30 kw main + 15 kw x 2 motor of each bobbin)
High-precision main roller
High-precision ingot alignment system
High productivity: 1000 plates/day (4")
High quality plates after cutting (BOW<15 microns, TTV<15 microns for 4")
Low cost of machine ownership and machine cost
The microcomputer controls the settings most suitable for the current work.
Programmable cutting options.
Vertical feed + arc swing not only has a positive effect on the cutting process, but also grinds the resulting plates, which affects the surface quality of the plates and accelerates their subsequent processing cycle. In a conventional cutting system, as the cross-section changes during the cutting process, the cutting speed also changes to compensate for changes in the linear contact of the wire with the ingot. This creates a non-permanent grinding effect and negatively affects the cutting quality.
OKSANA FS-6300D is a multi-wire cutting system that combines the latest technologies to increase productivity, cutting accuracy and overall working efficiency. In the FS-6300D series of machines, wire feeding and removal is provided directly, which ensures control of the wire tension accuracy and high wire movement speed using the servo motor torque control system. The system is designed to work with materials such as silicon carbide, sapphire, ceramics, ferrites, glasses, quartz, silicon, as well as with a variety of superhard and brittle materials, in the processing of which the determining factors are cutting accuracy and minimal losses.
The lower location of the cutting mechanism. The workpiece is fed from above.
Sawing takes place by elliptical movement of the cutting mechanism (swing + translational movement of the wire upwards) .
High wire movement speed and high cutting speed.
The wire tension accuracy is controlled by a servo motor and a tension sensor
Constant wire tension and stable wire feed control
Automatic wire winding.
Powerful motor (30 kw main + 15 kw x 2 motor of each bobbin)
High-precision main roller
High-precision ingot alignment system
High productivity: 1000 plates/day (4")
High quality plates after cutting (BOW<15 microns, TTV<15 microns for 4")
Low cost of machine ownership and machine cost
The microcomputer controls the settings most suitable for the current work.
Programmable cutting options.
Vertical feed + arc swing not only has a positive effect on the cutting process, but also grinds the resulting plates, which affects the surface quality of the plates and accelerates their subsequent processing cycle. In a conventional cutting system, as the cross-section changes during the cutting process, the cutting speed also changes to compensate for changes in the linear contact of the wire with the ingot. This creates a non-permanent grinding effect and negatively affects the cutting quality.
Installations of group heat treatment of plates
Atmospheric processes:
Features and Benefits:
Technical parameters:
LPCVD processes:
- pyrogenic (wet, steam) oxidation;
- dry oxidation;
- direct diffusion from solid carrier, liquid carrier or gas sources:BBr3, B2H6, POCL3, PH3, BN
- oxidation at elevated pressure (HiPOx);
- molding, annealing and sintering;
- pre-deposition from gaseous,
- liquid and solid sources.
Features and Benefits:
- The most modern control system
- The highest quality components are always selected to achieve excellent results on SVCS furnaces.
- Up to 4 quartz or silicon carbide (SiC) reactors (tubes) for various processes
- Advanced pipe cooling system
- Contactless fully automatic cantilever type loading system
Technical parameters:
- Plate size: 50mm, 75mm, 100mm, 150mm, 200mm, 300mm or any other.
- Loading plates SVaFUR-FP: 150 or more plates and SVaFUR-RD: 25 plates (usually)
- 3 or 5 zone heating system SVaFUR-FP:up to 1067mm (42") and SVaFUR-RD: up to 300mm (12")
- 0.5°C temperature uniformity along the length
- Temperature from 200°C to 1300°C
- Power consumption 95KW – 165KW depending on pipe configuration, 300mm: 3-phase, 400 or 480VA, 140 A, 50 60 Hz, 200mm: 3-phase, 400 or 480VA, 160A, 60Hz (systems can be adapted to the requirement of electrical connection in any country)
- dry clean air 70 – 110 psig (4.8 to 7.6 bar)
- Leading for cooling: 40 - 60 LPM, Exhaust 210m3/h per pipe
- Options: boat lift and automatic loading of the feeding blade
LPCVD processes:
- Silicon nitride;
- silicon dioxide;
- low temperature silicon oxide (LTO);
- high temperature silicon oxide (HTO);
- polysilicon, with or without temperature slope;
- processes using TEOS.
SiC IH-860DSIC
Ion implanters
SOPHI-200/260
Ion implanters
IMX-3500
Ion implanters
LSC 4000
Outdoor system
SWC 4000
Floor cleaning system
SWC 3000
Desktop cleaning system
SiC IH-860DSIC
High temperature implanters for mass production of SiC devices.
Features:
Features:
- Long-term high-temperature transplantation
- Ion energy up to 700 keV
- Sequential implantation implemented using Software
- Compact dimensions
- from R&D to mass production
SOPHI-200/260
Features:
- Plate size: 5 to 8 inches
- Compact design
- Excellent parallel beam performance
- application for ultra-thin plates
- semiconductors
- ultra-thin plates for devices such as power devices, etc.
- R&D and Research
IMX-3500
- Energy range: from 30 to 200 keV (single-charge ion)
- Plate size: max. ø150 mm (6 inches)
- Control system: Ion beam adjustment, manually.
- Transportation of plates manually.
- Vacuum setting, automatic.
The ion source and the beam acceleration unit have high reliability and maintainability, which has been proven by large sales of ion implantation units of the IDZ series operating at medium frequency current, manufactured by ULVAC. The terminal station consists of a compact plate holder chamber and a loading gateway chamber, tested in UP-150. Systems, including UP-150, have been used not only for semiconductors, but also for advanced research, such as changing surface properties.
LSC 4000
LSC Application
LSC Features
- cleaning of plates or substrates with
- structural elements applied or not applied
- cleaning of separated plates on the substrate
- cleaning of the ITO display coating
- cleaning of the photomask blank with a photoresist layer
- cleaning of the coated photomask
LSC Features
- Up to 21 inches round shape, 15” x15” inches square shaped substrate
- large artificial climate chamber with a maximum of three levers for:
- ultrasound
- brushes
- hot dianized water, high pressure DI or Piranha
- PC control via Lab View software
- combination with robotic loading and unloading (Robotic load unload)
SWC 4000
Features:
- free-standing installation
- damage protection, brushing, ultrasonic, chemical and rotary drying
- 12 inches - round, 9 inches - square substrates
- Microprocessor for control
- chemicals distribution module
- separate pipe for acids and solvents
- heated nitrogen
SWC 3000
Specifications:
- Desktop installation
- Cleaning of photomasks or plates without damage, ultrasonic cleaning and rotary drying
- 12 inches - round, 9 inches - square substrates
- Microprocessor for control
- IR lamp
- photomask or plate
- brushing (all surfaces or partially)
- Cleaning with chemicals (CDU)
- nitrogen ionizer, etc.
JEOL JBX-9300FS
Electron beam lithography device
JEOL JBX-6300FS
Electron beam lithography device
JEOL JBX-5500FS
Electron beam lithography device
JBX-3050MV
Electron beam lithography device
Installation of atomic layer deposition
Floor cleaning system
SI 500-300
ICP-RIE plasma etching units
SI 500 C
ICP-RIE plasma etching units
JEOL JBX-9300FS
The JBX-9300FS high-speed industrial electron beam lithography system is designed for the production of submicron and nanoscale semiconductor devices. The system can work with plates made of various materials with a diameter of up to 300 mm (12") inclusive, allows you to generate images with a frequency of 50 MHz, has high reliability and performance. The unique positioning system allows you to achieve high precision stitching of exposed areas, even in large fields of view.
Technical specifications:
Technical specifications:
- The shape of the beam is a round spot
- Scanning - Vector
- Accelerating voltage - 50kV/100kV
- Scanning speed - 50 MHz
- Minimum line width - no more than 20 nm
- The maximum diameter of the substrate is 300 mm (12 inches)
- The crosslinking error of the working areas is no more than 20nm in the field of view of 1 mm
JEOL JBX-6300FS
JBX-6300FS is an industrial electron beam lithography system designed for the production of submicron and nanoscale semiconductor devices. The system can work with plates made of various materials with a diameter of up to 203.2 mm (8") inclusive, allows you to generate images with a frequency of 25 MHz and a dynamic range of 19 bits, has high reliability and ease of control.
For convenience and speed of work, the JBX-6300FS implements 2 modes of lithography: high-speed (4-lens) and nanolithographic (5-lens).
Technical specifications:
For convenience and speed of work, the JBX-6300FS implements 2 modes of lithography: high-speed (4-lens) and nanolithographic (5-lens).
Technical specifications:
- The shape of the beam is a round spot
- Scanning - Vector
- Accelerating voltage - 25kV / 50kV/100kV
- Beam current - 30Pa – 20nA
- Minimum line width - no more than 8nm
- Minimum spot diameter - no more than 2 nm
- The maximum diameter of the substrate is 203.2 mm (8 inches)
- The crosslinking error of the working areas is no more than 20nm in the field of view of 62.5 microns
- The maximum size of the exposure area is 2mm * 2mm (4-lens mode, 25kV); 0.25mm * 0.25mm (5-lens mode, 25kV)
JEOL JBX-5500FS
JBX-5500FS is a compact electron beam lithography system designed for technology development and small–scale production of submicron and nanoscale semiconductor devices. The system can work with plates made of various materials with a diameter of up to 101.6 mm (4") inclusive, allows you to generate images with a frequency of 12 MHz and a dynamic range of 18 bits, has high reliability and ease of control.
For convenience and speed of work, the JBX-5500FS implements 2 lithography modes: high-speed (4-lens) and ultra-high-resolution (5-lens).
Technical specifications:
For convenience and speed of work, the JBX-5500FS implements 2 lithography modes: high-speed (4-lens) and ultra-high-resolution (5-lens).
Technical specifications:
- The shape of the beam is a round spot
- Scanning - Vector
- Accelerating voltage - 25kV / 50kV
- Beam current - 30Pa – 20nA
- Minimum line width - no more than 10nm
- The minimum spot diameter is no more than 6 nm
- The maximum diameter of the substrate is 102.6 mm (4 inches)
- , the crosslinking error of the working areas is no more than 40nm
- The maximum size of the exposure area is 2mm * 2mm (4-lens mode, 25kV); 0.2mm * 0.2mm (5-lens mode, 25kV)
JBX-3050MV
Due to the growth in the production of microchips with high degrees of integration, the demand of the global semiconductor industry for high-precision, high-performance photomask production systems is growing. The JEOL company, which is a leader in the production of industrial electron beam lithography systems, following the latest global trends, has released a new model - JBX–3050MV.
JBX-3050MV has high uniformity and beam density (up to 40A / cm2), the ability to change the shape of the beam, to carry out vector scanning. This system has absorbed all the best qualities of previous models, including the sales leader of the decade – JBX-3040MV. It is characterized by high reliability and productivity, and, thanks to this, in such a short period, it has proven itself perfectly at the leading enterprises of the world.
Technical specifications:
JBX-3050MV has high uniformity and beam density (up to 40A / cm2), the ability to change the shape of the beam, to carry out vector scanning. This system has absorbed all the best qualities of previous models, including the sales leader of the decade – JBX-3040MV. It is characterized by high reliability and productivity, and, thanks to this, in such a short period, it has proven itself perfectly at the leading enterprises of the world.
Technical specifications:
- The shape of the beam is Changeable
- Scanning - Vector
- Accelerating voltage - 50 kV
- Current density - 40A/cm2
- Uniformity - no more than 3.5 nm (3σ
- Positioning accuracy - no more than 7 nm (3σ)
Installation of atomic layer deposition
Atomic Layer Deposition (ALD) is the process of deposition of very thin films with high uniformity and 3D structure layer by layer. High-precision control of the thickness and properties of the resulting films is provided by the addition of precursors to the vacuum chamber in separate cycles during the deposition process. Plasma-stimulated atomic Layer Deposition (PEALD - Plasma Enhanced Atomic Layer Deposition) is an advanced method that expands the possibility of ALD by using gas particle radicals instead of water as an oxidizer in the deposition process.
Based on many years of successful experience in the development and production of PECVD and ICPECVD systems, including the patented ICP source in the form of a triple planar helical antenna (PTSA), SENTECH is proud to announce the launch of the first PEALD system. The new ALD system allows both thermal and plasma stimulated deposition modes to be implemented, and also uses a SENTECH ellipsometer to monitor deposition. SENTECH offers the most advanced and modern ultra-fast in-situ ellipsometers for monitoring the growth of deposited films layer by layer using both laser and spectroscopic ellipsometers.
The first PEALD system has already been implemented in the laboratory of the Braunschweig Technical University for the deposition of extremely homogeneous and dense thin films such as Al2O3, ZnO. The PEALD system showed excellent parameters for the uniformity and refractive index of the resulting layers.
Based on many years of successful experience in the development and production of PECVD and ICPECVD systems, including the patented ICP source in the form of a triple planar helical antenna (PTSA), SENTECH is proud to announce the launch of the first PEALD system. The new ALD system allows both thermal and plasma stimulated deposition modes to be implemented, and also uses a SENTECH ellipsometer to monitor deposition. SENTECH offers the most advanced and modern ultra-fast in-situ ellipsometers for monitoring the growth of deposited films layer by layer using both laser and spectroscopic ellipsometers.
The first PEALD system has already been implemented in the laboratory of the Braunschweig Technical University for the deposition of extremely homogeneous and dense thin films such as Al2O3, ZnO. The PEALD system showed excellent parameters for the uniformity and refractive index of the resulting layers.
SI 500-300
- Excellent uniformity, excellent reproducibility during etching
- The possibility of etching structures with nano dimensions
- High etching speed
- Low level of damage
- High aspect ratio
- PTSA - (P)lanar(T)ripple (S)piral (A)ntenna planar ICP source
- Vacuum Loading gateway
- Helium cooling of the substrate
- The operations are controlled by a computer
- Application for III/V, quartz, sapphire, micro optics, microsystems, microwave, nanotechnology
- SENTECH Software
- The diameter of the processed plates is up to 300mm.
- Installation through the wall (optional)
- Interferometer (determination of the etching rate, the end of the process - endpoint detection)
SI 500 C
SI 500 C PTSA Plasma Cryo Etcher - cryogenic etching unit in inductively coupled plasma (ICP-RIE) manufactured by SENTECH Instruments GmbH (Germany)
- Excellent uniformity, excellent reproducibility during etching
- High etching speed
- Low level of damage
- High aspect ratio
- Very smooth walls
- PTSA - (P)lanar (T)riple (S)piral (A)ntenna ICP source
- Wide range of substrate temperature: - 150°C to 400°C
- Vacuum Loading gateway
- The operations are controlled by a computer
- SENTECH Software
- The diameter of the processed plates is up to 200mm.
- Installation through the wall (optional)
- Interferometer (determination of the etching rate, the end of the process - endpoint detection)
Request for equipment
You can order the equipment you are interested in using the form below. Specialists of Silk Way XXI century LLC will contact you in the near future to clarify your order and advise on all questions of interest.
